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Publicationer information ikon

Interfacial Reactions in Thin Film Systems

Zeng, K.; Laurila, T.; Kivilahti, J.
-1999Publicationer information ikon

Analyses of Interfacial Reactions at Different Levels of Interconnections

Referentgranskad
Laurila, Tomi; Kivilahti, Jorma
-2004Publicationer information ikon

Interfacial reactions between SnAg1.0Ti and Ni metallization

Referentgranskad
DOI
10.1007/s10854-012-0698-5
Laurila, Tomi; Dong, Hongqun; Vuorinen, Vesa
Journal of Materials Science: Materials in Electronics2012Publicationer information ikon

Interfacial reactions in the Si/TaC/Cu system

Referentgranskad
DOI
10.1016/j.mee.2004.02.002
Laurila, Tomi; Molarius, Jyrki; Kivilahti, J.K.
Microelectronic Engineering2004Publicationer information ikon

Interfacial reactions in the Si/TaC/Cu system

Referentgranskad
DOI
10.1016/j.mee.2004.02.002
Laurila, Tomi; Molarius, J.; Kivilahti, J.K.
Microelectronic Engineering2004Publicationer information ikon

Analyses of interfacial reactions at different levels of interconnection

Referentgranskad
DOI
10.1016/j.mssp.2004.09.129
Laurila, T.; Vuorinen, V.; Kivilahti, J. K.
Materials Science in Semiconductor Processing2004Publicationer information ikon

Solder/Substrate Interfacial Reactions in Sn-Cu-Ni Interconnection System

Referentgranskad
Yu, Hao; Vuorinen, Vesa; Kivilahti, Jorma
Journal of Electronic Materials2007Publicationer information ikon

Interfacial reactions between lead-free solders and common base materials

Referentgranskad
DOI
10.1016/j.mser.2005.03.001
Laurila, Tomi; Vuorinen, Vesa; Kivilahti, Jorma
Materials Science and Engineering R: Reports2005Publicationer information ikon

Another look at the interfacial interaction parameter

Referentgranskad
Öppen tillgång
DOI
10.1016/j.jcis.2018.06.015
Makkonen, Lasse; Kurkela, Juha
Journal of Colloid and Interface Science2018Publicationer information ikon

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

Referentgranskad
DOI
10.1007/s11664-016-5272-0
Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
Journal of Electronic Materials2017

Interfacial Reactions in Thin Film Systems

1999

Analyses of Interfacial Reactions at Different Levels of Interconnections

Referentgranskad
2004

Interfacial reactions between SnAg1.0Ti and Ni metallization

Referentgranskad
DOI
10.1007/s10854-012-0698-5
2012

Interfacial reactions in the Si/TaC/Cu system

Referentgranskad
DOI
10.1016/j.mee.2004.02.002
2004

Interfacial reactions in the Si/TaC/Cu system

Referentgranskad
DOI
10.1016/j.mee.2004.02.002
2004

Analyses of interfacial reactions at different levels of interconnection

Referentgranskad
DOI
10.1016/j.mssp.2004.09.129
2004

Solder/Substrate Interfacial Reactions in Sn-Cu-Ni Interconnection System

Referentgranskad
2007

Interfacial reactions between lead-free solders and common base materials

Referentgranskad
DOI
10.1016/j.mser.2005.03.001
2005

Another look at the interfacial interaction parameter

Referentgranskad
Öppen tillgång
DOI
10.1016/j.jcis.2018.06.015
2018

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

Referentgranskad
DOI
10.1007/s11664-016-5272-0
2017